电子电路大全(PDF格式)-第92部分
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3。2。2 主要技术指标················································································································ （169）
3。2。3 芯片封装与引脚功能···································································································· （169）
3。2。4 内部结构与工作原理···································································································· （170）
3。2。5 应用电路设计················································································································ （175）
3。3 OOK/ASK 868。35 MHz 收发器芯片TR1001 的原理与应用电路设计···································· （182）
3。3。1 概述······························································································································· （182）
3。3。2 主要技术指标················································································································ （183）
3。3。3 芯片封装及引脚功能···································································································· （183）
3。3。4 芯片内部结构及工作原理····························································································· （186）
3。3。5 应用电路设计················································································································ （190）
3。3。6 DR3001 模块················································································································· （192）
3。4 868MHz ASK/FSK 无线收发器芯片TDA 5250 的原理与应用电路设计································ （194）
3。4。1 概述······························································································································· （194）
3。4。2 主要技术指标················································································································ （194）
3。4。3 芯片封装与引脚功能···································································································· （195）
3。4。4 内部结构与工作原理···································································································· （197）
3。4。5 应用电路设计················································································································ （200 ）
3。5 433/870/915MH FSK 收发器芯片XE1202 的原理与应用电路设计······································· （204 ）
3。5。1 概述······························································································································· （204 ）
3。5。2 主要技术指标················································································································ （205 ）
3。5。3 芯片封装与引脚功能···································································································· （205 ）
3。5。4 内部结构与工作原理···································································································· （207 ）
3。5。5 应用电路设计················································································································ （212 ）
3。5。6 与微控制器的接口········································································································ （216 ）
3。6 433MHz FSK 收发器芯片 nRF0433 的原理与应用电路设计·················································· （219 ）
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3。6。1 概述······························································································································· （219 ）
3。6。2 主要性能指标················································································································ （219 ）
3。6。3 芯片封装与引脚功能···································································································· （220 ）
3。6。4 内部结构与工作原理···································································································· （220 ）
3。6。5 应用电路设计················································································································ （222 ）
3。7 433/868/915MHz FSK/ASK/OOK 收发器芯片RF2945 的原理与应用电路设计····················· （225 ）
3。7。1 概述······························································································································· （225 ）
3。7。2 主要技术指标················································································································ （225 ）
3。7。3 芯片封装与引脚功能···································································································· （226 ）
3。7。4 内部结构与工作原理···································································································· （229 ）
3。7。5 应用电路设计················································································································ （229 ）
3。7。6 电路设计实例·························································································�
